The High Yield™ series thin film metrology utilizes hybrid technology of Mueller matrix and reflective spectroscopy, which enables a variety of multi-layer and complex structures measurement including thickness of thin film, reflective index (n & k), band gap, defect, etc. The system is capable of measuring complex structures such as multi-layers, ONO, etc. this product is suitable for process...
Åthena Xcellence™ T series X-ray thin-film metrology techniques adopt the free combinations of fast X-ray reflection (XRR), X-ray fluorescence (XRF), and grazing Incidence X-Ray Fluorescence (GIXRF) in order to achieve a fast and accurate measurement of for thin films and ultra-thin films with complex multi-layer. Åthena Xcellence™ T series features a fast delivery of the information of compositions...
Åthena Xcellence™ LE series is a self-developed X-ray fluorescence (XRF) technology with high throughput, which offers superior composition measurement of light elements such as B, P, C, O, N, F, etc. The Åthena Xcellence™ LE series enables non-damage thin film composition analysis of various samples, such as BPSG, PSG, FSG, P doped Poly, CHM, etc. Additionally, Åthena Xcellence™ LE series can be...
The High Yield™Competence series is designed for the optical critical dimension(CD) measurements for complex structure such as FinFET, vertical stacked NAND, DRAM and other cutting-edge technology nodes. It is capable of measuring height of side wall, depth, width, shape and profile of 2D and 3D samples of ADI, AEI, and other photomask fabrication processes. This system is suitable for complex...
With the continuous development of semiconductor technology, the process is becoming more and more complex, and the critical dimensions are turning smaller and smaller. X-ray CD metrology with the wavelength at the angstrom level will play an important role in the field of wafer fabrication. Athena Xcellence™ Competence is a self-developed CE measurement technique, that offers high resolution...
The surface contamination and metal particles on the wafer will lead to device failure. The Athena Fulfillment™ TXRF technology provides effective surface contamination detection and composition analysis, which enables the high efficiency and accuracy of yield control in wafer fabrication process.
Åthena Xcellence™ D series features the fast X-ray diffraction (XRD) technology that provides superior performance for analyzing for the lattice structure and film thickness of various Epi materials, such as the stress, strain, composition, relaxation, THK, etc. This system is suitable for complex applications such as process development, material stress engineering development...